GF Series Thermally Conductive Potting Encapsulant

GF series thermally conductive potting encapsulant provides thermal conductivity and electrical insulative characteristics delivered in a two-part dispensable and easily automated product. Additionally, the GF series provides protection from shock, dust, water, and vibration.

Features: thermal conductivity: liquid adhesive 0.8 ~ 3.6W/m.K, electrically insulating thermal conductive sealant.
Applications: electric vehicle (EV) batteries, 5G, autopilot system, mobile phone, AIOT, HPC (high performance computing), server, IC, CPU, MOS, LED, mother board, power supply, microinverter, LCD-TV, notebook, PC, telecom device, battery energy storage system, wireless Hub, DDR ll Module, mechatronic drive syste