TF series thermal conductive gap filler are two-part, 1:1 ratio, ceramic filled silicone dispensable gap fillers. Curing at room temperature lends itself to high volume automation. Typical applications are where high tolerances are present and designs require reduced mechanical stresses.

Features: two-part dispensable gap filler, liquid adhesive, thermally conductive potting compound, improved cost effectiveness with rapid/low temperature cure.
Applications: automotive electronics (ADAS, HEV, NEV, batteries, ECU, EMS, ITM, AC/DC), telecommunications, computer and peripherals, battery energy storage system, between heat-generating semiconductors and a heat sink, mechatronic drive systems, GaN Chargers.