TP300 an extremely soft gap filler pad that also harnesses exceptional thermally conductive characteristics. TP300 can meet the design needs of numerous design requirements and specifications. TP300 will provide the innate thermal requirements your design needs without over stressing the components or cases.

Features: soft and highly compliant, naturally tacky, easing application.
Applications: industrial LEDs, power supplies and conversion, PCB, laptop, chipset, M.2 heat sink, super charge, IPC and medical power supplies, packaged modules, DIN rail power supplies, DC/DC converters and modular DC UPS systems, GaN Chargers.