Professional thermal management solutions for different modules in camera systems
To combat the high heat generated by image processing, the TP200-H25-L utilizes a dedicated cooling strategy. Thermal silicone pads directly conduct heat from the core components to the unit's robust aluminum back cover, which acts as a passive heat sink for reliable thermal dissipation.
For optimal power system thermal management, the TP300-H30-PO bridges high-power components like MOSFETs and PMICs to cooling solutions. Its 3.0mm (H30) thickness fills gaps and conforms to uneven surfaces, ensuring maximum heat transfer for improved safety and efficiency.
In camera modules, the TP400-H40-9 ensures reliable operation by filling gaps between the mainboard's CPU/memory and the housing, turning it into an effective heat sink for thermal dissipation.
TP Series Thermal Silicone Pad Technical Parameters & Certifications
Attribute | Value |
---|---|
Thermal Conductivity | 1.0 ~ 15.0 W/mK |
Hardness (Shore 00) | 20 ~ 80 |
Thickness Range | 0.5mm ~ 10.0mm (Customizable) |
Operating Temperature | -40°C ~ 200°C |
Certification Standards | RoHS, REACH, UL |
Special Properties | Low volatility, low oil bleeding, excellent insulation, high compressibility |
AOK Professional Thermal Solutions vs Industry Standard Solutions
Based on your structural design requirements, we provide precision die-cutting in any shape for direct production line assembly and seamless integration.
For project requirements, we provide 24-hour rapid sampling service to accelerate your R&D and testing processes, ensuring faster time-to-market.
Understanding your specific needs and application scenarios
Developing customized thermal management solutions
Providing samples for testing within 24 hours
Collaboratively verifying product performance and effectiveness
Volume production with on-time delivery