Thermal transfer putty is a soft, moldable material designed to enhance heat transfer between electronic components, such as a CPU or GPU, and their heatsinks. It's particularly useful for filling uneven gaps or surfaces where traditional thermal paste might not be as effective.
Silicone thermal pads and thermal paste both serve the same purpose—improving heat transfer between components—but their distinct characteristics make them suitable for different applications. Here’s why thermal paste remains more widely used despite the advantages of silicone thermal pads:
When using thermal conductive pads, consider the following key factors to ensure optimal performance and avoid common pitfalls:
Soft silicone thermal pads need to be compressed to at least two-thirds of their original thickness to ensure they effectively transfer heat between surfaces, such as a CPU and a heatsink.
Thermal pads are used in specific scenarios where their unique properties offer advantages over thermal paste. Thermal pads excel in scenarios prioritizing ease of use, durability, insulation, and mechanical flexibility.