1. Consistency:
•Thermal Paste: It's typically a viscous, paste-like substance, designed to fill microscopic gaps between surfaces (like a CPU and a heatsink) to improve heat transfer.
•Thermal Putty: Has a thicker, more clay-like consistency. It stays soft and pliable, so it can fill in larger gaps compared to paste and is often used in applications requiring slightly thicker thermal material.
2. Application:
•Thermal Paste: Applied as a thin layer between two tightly joined surfaces, which is common in CPUs and GPUs.
•Thermal Putty: Suited for uneven or less tightly joined surfaces. It's thicker consistency allows it to fill larger gaps without drying out or being displaced.
3. Thermal Performance:
•Thermal Paste: Generally offers high thermal conductivity for very thin applications.
•Thermal Putty: Often has lower thermal conductivity than paste, but it performs well in applications requiring more flexibility or coverage.
Thermal putty might be more suitable for larger components or automotive electronics where surface conformity is an issue, while thermal paste is generally used in more compact and high-performance applications, like computer processors.
If you would like to learn more about AOK performance thermal materials, please visit our website at www.aok-technologies.com
Updated on：2025-03-07 14:04:50