TP200-S gap filler pad, is key when your thermal needs begin to changed from design enhancement to thermal requirement. At 2.0W/m.K, TP200-S begins to add that extra thermal punch many designs require to keep specifications within thermal design targets.

Features: soft and highly compliant, naturally tacky, easing application.
Applications: electro-optical and radar sensors, navigation systems, inertial sensors, GNSS and robotics, speed sensors, displays, embedded computers, power control & conditioning systems, RF & microwave products, networking and telecommunications, notebooks, tablets, power conversion, SSD, NVMe, VAM, VRAM, heat sink, EMS, ITM, MCU.